PhotoRelays
Photorelays are the most relable,technicaly advanced logic-to-power interface devices.Their basic function is to take a low current signal from a microprocessor to control the switching of both ACand DC loads,while providing an isolation barier between logic andpower.

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Features
● SOP package 4 Pin type in miniature design(4.4×4.3×2.1mm /.173×.169×.083inch)
● Low driver power requirements(TTL/CMOS Compatible)
● No moving parts
● High reliability

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Features
● Features
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● Arc-Free with no snubbing circuits
● 3750 / 5000 Vrms Input/Output isolation

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Description
The 40G-Thin Film modulator design is based on a dual parallel structure of 2 Mach-Zehnder modulators embedded in a Mach-Zehnder super-structure. Each internal modulator is designed to have EO bandwidth above 20 GHz.

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Description
F-tone Networks broadband phase modulators combine high linearity with low driving voltage and small footprint, covering all the frequency range up to 10 GHz.

Features
● Low driver power requirements (TTL/CMOS Compatible)
● Contact form: Normally-Off (1b)
● Load voltage: 400V max.
● On-Resistance: 50Ω max.

Description
The FT-46-40G-IQ-XT modulator design is based on a dual parallel structure of two Mach-Zehnder modulators embedded in a Mach Zehnder super-structure. Each internal modulator is designed to have EO bandwidth above 20

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

Description
F-tone Networks Broadband Analog Intensity Modulators combine high linearity with low driving voltage and small footprint, covering frequency range from 20 GHz to beyond 40 GHz (FT-46-AM20-XT: 20 - 30 GHz; FT-46-AM40-XT:

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

Description
F-tone Networks High Bandwidth Zero-Chirp FT-46-F10 modulators are based on the Mach-Zehnder Interferometer (MZI) architect ure. They are manufactured using the highly reliable titanium indiffusion technology in X-Cut, Y-...